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  6. 3M™ Electrically Conductive Double-Sided Tape 5113DFT-50, Gray, 25 mm x 10 m, 12 Rolls/Case

3M™ Electrically Conductive Double-Sided Tape 5113DFT-50, Gray, 25 mm x 10 m, 12 Rolls/Case

  • 3M ID 7100313600
  • UPC 00068060428219

XYZ-axis conductivity through the adhesive

Excellent grounding with small contact areas for micro-electronic design

High-performance in humid conditions for greater design flexibility

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Kiemelések
  • XYZ-axis conductivity through the adhesive
  • Excellent grounding with small contact areas for micro-electronic design
  • High-performance in humid conditions for greater design flexibility
  • Excellent EMI shielding in bond line gap
  • 4-year shelf-life for reliable, consistent performance over time
  • Long-term performance at high temperatures (105˚C) for demanding applications
  • Adhesion to select low surface energy substrates
  • Helps control signal interference through PIM mitigation for higher signal integrity and performance
  • Conformable - precise placement in tight spaces to create EMI sealed bond lines

3M™ Electrically Conductive Double-Sided Tape 5113DFT is an XYZ-axis double-sided fabric tape (DFT) consisting of a conductive matrix carrier and 3M's innovative new conductive polyolefin pressure sensitive adhesive (PSA). Based on 3M's new propriety polyolefin conductive adhesive and a combination of Ni/Cu/Ni-coated conductive woven carrier, 3M tape 5113DFT provides exceptional performance including high adhesion, low electrical resistance, long shelf life, resistance to high temperatures and humidity and excellent grounding and shielding performance.

Used for grounding, PSA attachment and EMI shielding designs, 3M tape 5113DFT helps provide robust protection against EMI in a range of market segments including: General Industrial Electronics, Aerospace and Defense Electronics, Appliances, Automotive, Electronics and IoT Devices, Communications Infrastructure, and Medical Equipment. These electrically conductive pressure sensitive adhesive (PSA) tapes provide excellent adhesion to a variety of substrates including metals and plastics. They are ideal for EMI/RFI shielding and gasket attachment, FPC grounding, sensor grounding, PCB/flex/chassis grounding, and electrostatic discharge protection.

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